ResearchMoz presents professional and in-depth study of "Thermal Management Technologies for Semiconductor Microchips".
Report Highlights
The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
Get PDF for more Professional and Technical insights @ https://www.researchmoz.us/enquiry.php?type=S&repid=1377207
Report Includes
An overview of the global market for thermal management in semiconductor microchips.
Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022.
Analyses of the market types of substrate material, properties of substrate material, end-user industries, product type, and region.
A look into the market drivers, such as renewable energy, automotive industry, consumer appliances, and light-emitting diodes.
Profiles of the major companies in the market.
Report Scope
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. Unlike SMC024K, The Market for Thermal Management Technologies, which covers the entire semiconductor market based on similar product types and various end-user application industries, the scope of this report covers cooling solutions for microprocessors chips (“microchips”); selection of suitable thermal management materials; and development of advanced cooling solutions based on several heat-transfer technologies (fans and blowers, heat sinks, heat pipes, cold plates).
View Complete TOC with tables & Figures @ https://www.researchmoz.us/thermal-management-technologies-for-semiconductor-microchips-report.html/toc
Significant advancements in the electronic industry have led to huge demands for smarter products with high power densities. In any such product, many components are attached to an electronic circuit board and many of these components generate heat during any operation. A microprocessor chip (microchip) is the major source of heat generation in an electronic product; though it consumes power in milliwatts, the power density is very high. When the size of the microchip decreases, its speed increases simultaneously with the heat generation. When that occurs, the adjacent components of a circuit board are severely affected by the high temperature. This necessitates the call for advanced heat-dissipation solutions for microchips. In addition, power electronics, medical devices, and various high-heat applications are designed in compressed sizes and require enhanced thermal technologies to absorb the heat penetration.
This report also highlights the major players in each of the regional markets for thermal management in microchips. It explains the major market drivers of the global thermal management industry, the current trends within the industry, and the regional market dynamics for global thermal management products used in microchips. The report also provides detailed information about the suppliers involved, along with complete profiles of the major global vendors in the thermal management industry for microchips and data on the market shares of the major players in each region.
Table of Contents
Chapter 1: Introduction - 1
Study Goals and Objectives- 1
Reasons for Doing This Study - 2
Scope of Report - 2
Information Sources - 2
Methodology - 3
Intended Audience - 3
Geographic Breakdown - 3
Analyst's Credentials - 6
Related BCC Research Reports- 6
Chapter 2: Summary and Highlights - 8
Chapter 3: Market and Technology Background - 12
Definition - 12
Semiconductor Materials - 13
Semiconductor Industry - 13
Semiconductor Microchips - 14
Thermal Management - 14
Importance of Thermal Management - 14
Power Dissipation - 15
Environmental and Regulatory Factors - 17
Factors That Influence Thermal Performance - 18
Thermal Resistance - 18
Material - 18
Make An Enquiry @ https://www.researchmoz.us/enquiry.php?type=E&repid=1377207
Fin Efficiency - 18
Spreading Resistance - 19
Surface Color - 19
Types of Thermal Management Materials - 19
Metals - 20
Alloys - 21
Ceramics - 22
Carbonaceous Materials - 24
Composites - 27
For More Information Kindly Contact:
ResearchMoz
Mr. Nachiket Ghumare,
90 State Street, Albany NY, United States - 12207
Tel: +1-518-621-2074
USA-Canada Toll Free: 866-997-4948
Email: sales@researchmoz.us
Follow us on LinkedIn @ http://bit.ly/1TBmnVG
Follow me on : https://marketinfo247.wordpress.com/
Report Highlights
The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
Get PDF for more Professional and Technical insights @ https://www.researchmoz.us/enquiry.php?type=S&repid=1377207
Report Includes
An overview of the global market for thermal management in semiconductor microchips.
Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022.
Analyses of the market types of substrate material, properties of substrate material, end-user industries, product type, and region.
A look into the market drivers, such as renewable energy, automotive industry, consumer appliances, and light-emitting diodes.
Profiles of the major companies in the market.
Report Scope
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. Unlike SMC024K, The Market for Thermal Management Technologies, which covers the entire semiconductor market based on similar product types and various end-user application industries, the scope of this report covers cooling solutions for microprocessors chips (“microchips”); selection of suitable thermal management materials; and development of advanced cooling solutions based on several heat-transfer technologies (fans and blowers, heat sinks, heat pipes, cold plates).
View Complete TOC with tables & Figures @ https://www.researchmoz.us/thermal-management-technologies-for-semiconductor-microchips-report.html/toc
Significant advancements in the electronic industry have led to huge demands for smarter products with high power densities. In any such product, many components are attached to an electronic circuit board and many of these components generate heat during any operation. A microprocessor chip (microchip) is the major source of heat generation in an electronic product; though it consumes power in milliwatts, the power density is very high. When the size of the microchip decreases, its speed increases simultaneously with the heat generation. When that occurs, the adjacent components of a circuit board are severely affected by the high temperature. This necessitates the call for advanced heat-dissipation solutions for microchips. In addition, power electronics, medical devices, and various high-heat applications are designed in compressed sizes and require enhanced thermal technologies to absorb the heat penetration.
This report also highlights the major players in each of the regional markets for thermal management in microchips. It explains the major market drivers of the global thermal management industry, the current trends within the industry, and the regional market dynamics for global thermal management products used in microchips. The report also provides detailed information about the suppliers involved, along with complete profiles of the major global vendors in the thermal management industry for microchips and data on the market shares of the major players in each region.
Table of Contents
Chapter 1: Introduction - 1
Study Goals and Objectives- 1
Reasons for Doing This Study - 2
Scope of Report - 2
Information Sources - 2
Methodology - 3
Intended Audience - 3
Geographic Breakdown - 3
Analyst's Credentials - 6
Related BCC Research Reports- 6
Chapter 2: Summary and Highlights - 8
Chapter 3: Market and Technology Background - 12
Definition - 12
Semiconductor Materials - 13
Semiconductor Industry - 13
Semiconductor Microchips - 14
Thermal Management - 14
Importance of Thermal Management - 14
Power Dissipation - 15
Environmental and Regulatory Factors - 17
Factors That Influence Thermal Performance - 18
Thermal Resistance - 18
Material - 18
Make An Enquiry @ https://www.researchmoz.us/enquiry.php?type=E&repid=1377207
Fin Efficiency - 18
Spreading Resistance - 19
Surface Color - 19
Types of Thermal Management Materials - 19
Metals - 20
Alloys - 21
Ceramics - 22
Carbonaceous Materials - 24
Composites - 27
For More Information Kindly Contact:
ResearchMoz
Mr. Nachiket Ghumare,
90 State Street, Albany NY, United States - 12207
Tel: +1-518-621-2074
USA-Canada Toll Free: 866-997-4948
Email: sales@researchmoz.us
Follow us on LinkedIn @ http://bit.ly/1TBmnVG
Follow me on : https://marketinfo247.wordpress.com/
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